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On November 28th at 19:30, the 4th issue of “Smart Ape Smart Computing Cluster Open Class” will be held, with the topic “Smart Computing Center AI Scale-Up Networking Technology” by Tang Jie, VP of Solutions at Resnics Technology.
The scale of IQ cluster is getting bigger and bigger, from the initial thousand cards, ten thousand cards to today’s one hundred thousand cards. While the scale of IQ clusters has grown rapidly, people have begun to pay attention to how to ensure that efficient collaboration among super-sized cards is the key to fully utilize the cluster’s computational performance. This has led to the further realization that, for the construction of ultra-large-scale smart computing clusters, the smart computing network has become one of the key technologies that are as important as or even more important than the computing chip.
Scale-Out and Scale-Up are two of the most popular computing network technologies, Scale-Out realizes RDMA function between GPUs through Ethernet or Infiniband, which is called front-end network, while Scale-Up is used for high-speed interconnection between GPUs, which can realize memory read/write across GPUs, which is also called back-end network. In essence, Scale-Out and Scale-Up are both designed to realize data transfer between GPUs in terms of memory, so what is the essential difference between the two? Why can’t the two be combined into one?
In this open class, Mr. Tang Jie will first explain why there is a Scale-Up/Out distinction in AI smart computing networks, and then focus on the problems that Resnics StarLink interconnect technology is trying to solve, as well as the technical characteristics of StarLink implementation and the technical path to realize StarLink interconnect in smart computing centers.
About Us
Resnics Technology (Shanghai), Inc. (abbr. Resnics Technology) was founded in 2020. The company is headquartered in Shanghai Caohejing New Tech Zone, China. Our team consists of core professionals in the fields of networking, storage and switching from leading companies in the industry at home and abroad.
We are dedicated to providing high-bandwidth, low-latency interconnective network chip products for Data Centers, Carriers, Enterprises and Homes.
Resnics Technology aims to become a global leader in providing innovative semiconductor solutions that connect everything and empower everyone.